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Showing results for soldering test; well test. Your search for soldering test【机】;weld test【机】 retrieved no results.

Select item 101789261.

Microwave Soldering of Low-Resistance Conductive Joints—Technical and Economic Aspects

Sorin Vasile Savu, Cristian Daniel Ghelsingher, Iulian Stefan, Nicusor-Alin Sîrbu, Daniela Tarniță, Dalia Simion, Ionel Dănuț Savu, Ionela Gabriela Bucșe, Traian Țunescu

Materials (Basel) 2023 May; 16(9): 3311. Published online 2023 Apr 23. doi: 10.3390/ma16093311

PMCID:: PMC10178926

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Select item 96563952.

Path Planning of Laser Soldering System Based on Intelligent Algorithm

Cong Zhang, Zige Fan, Yaonan Dai, Hang Chen, Sikai Wang, Xubing Chen

Sensors (Basel) 2022 Nov; 22(21): 8120. Published online 2022 Oct 24. doi: 10.3390/s22218120

PMCID:: PMC9656395

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Low-Temperature Soldering of Surface Mount Devices on Screen-Printed Silver Tracks on Fabrics for Flexible Textile Hybrid Electronics

Rocío Silvestre, Raúl Llinares Llopis, Laura Contat Rodrigo, Víctor Serrano Martínez, Josué Ferri, Eduardo Garcia-Breijo

Sensors (Basel) 2022 Aug; 22(15): 5766. Published online 2022 Aug 2. doi: 10.3390/s22155766

PMCID:: PMC9370845

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Characterization of Zn-Mg-Sr Type Soldering Alloy and Study of Ultrasonic Soldering of SiC Ceramics and Cu-SiC Composite

Roman Kolenak, Alexej Pluhar, Jaromir Drapala, Paulina Babincova, Matej Pasak

Materials (Basel) 2023 May; 16(10): 3795. Published online 2023 May 17. doi: 10.3390/ma16103795

PMCID:: PMC10224417

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Automatic Joining of Electrical Components to Smart Textiles by Ultrasonic Soldering

Sebastian Micus, Michael Haupt, Götz T. Gresser

Sensors (Basel) 2021 Jan; 21(2): 545. Published online 2021 Jan 14. doi: 10.3390/s21020545

PMCID:: PMC7828705

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Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite

Roman Kolenak, Igor Kostolny, Jaromir Drapala, Paulina Babincova, Matej Pasak

Materials (Basel) 2021 Nov; 14(21): 6369. Published online 2021 Oct 25. doi: 10.3390/ma14216369

PMCID:: PMC8585135

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Variable-Structure Proportional–Integral–Derivative Laser Solder Joint Temperature Intelligent Control Method with Adjustable Power Upper Limit

Mingchao Li, Pengbin Cao, Cong Zhang, Kuan Yan, Yuquan Zhang

Micromachines (Basel) 2023 Aug; 14(8): 1618. Published online 2023 Aug 17. doi: 10.3390/mi14081618

PMCID:: PMC10456599

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Soldering Electronics to Smart Textiles by Pulsed Nd:YAG Laser

Sebastian Micus, Michael Haupt, Götz T. Gresser

Materials (Basel) 2020 Jun; 13(11): 2429. Published online 2020 May 26. doi: 10.3390/ma13112429

PMCID:: PMC7321379

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Microstructure evolution and grain refinement of ultrasonic-assisted soldering joint by using Ni foam reinforced Sn composite solder

Huang He, Lizhi Song, Haitao Gao, Yong Xiao, Yi Cao

Ultrason Sonochem. 2023 Jan; 92: 106244. Published online 2022 Dec 2. doi: 10.1016/j.ultsonch.2022.106244

PMCID:: PMC9763506

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Analysis of Hot Bar Soldering, Insulation Displacement Connections (IDC), and Anisotropic Conductive Adhesives (ACA), for the Automated Production of Smart Textiles

Sebastian Micus, Ivan Kirsten, Michael Haupt, Götz T. Gresser

Sensors (Basel) 2020 Jan; 20(1): 5. Published online 2019 Dec 18. doi: 10.3390/s20010005

PMCID:: PMC6982759

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Advanced Analysis of the Properties of Solid-Wire Electric Contacts Produced by Ultrasonic Welding and Soldering

Andraž Logar, Damjan Klobčar, Aleš Nagode, Uroš Trdan, Gregor Černivec, Abhay Sharma

Materials (Basel) 2024 Jan; 17(2): 334. Published online 2024 Jan 9. doi: 10.3390/ma17020334

PMCID:: PMC10817488

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Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow

Nur Syahirah Mohamad Zaimi, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al-Bakri Abdullah, Nur Izzati Muhammad Nadzri, Andrei Victor Sandu, Petrica Vizureanu, Mohd Izrul Izwan Ramli, Kazuhiro Nogita, Hideyuki Yasuda, Ioan Gabriel Sandu

Materials (Basel) 2022 Apr; 15(8): 2758. Published online 2022 Apr 8. doi: 10.3390/ma15082758

PMCID:: PMC9029271

Article PDF–18M

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Strong bonding of corneal incisions using a noncontact fiber-optic laser soldering method

Svetlana Basov, David Varssano, Max Platkov, Ilan Gabay, Mordechai Rosner, Irina Barequet, Marcel Rattunde, Joachim Wagner, Mickey Harlev, Doron Ofer, Ilana Nisky, Yair Dankner, Abraham Katzir

J Biomed Opt. 2019 Dec; 24(12): 128002. Published online 2019 Dec 28. doi: 10.1117/1.JBO.24.12.128002

PMCID:: PMC7006038

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Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low Temperature

Siliang He, Jian Jiang, Yu-An Shen, Lanqing Mo, Yuhao Bi, Junke Wu, Chan Guo

Materials (Basel) 2024 Mar; 17(5): 1055. Published online 2024 Feb 25. doi: 10.3390/ma17051055

PMCID:: PMC10934809

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The Interconnecting Process and Sensing Performance of Stretchable Hybrid Electronic Yarn for Body Temperature Monitoring

Fenye Meng, Shaoqing Dai, Yong Zhang, Jiyong Hu

Polymers (Basel) 2024 Jan; 16(2): 243. Published online 2024 Jan 15. doi: 10.3390/polym16020243

PMCID:: PMC10820523

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Select item 911934116.

Building a Simple and Versatile Illumination System for Optogenetic Experiments

Phillip Kyriakakis, Lourdes Fernandez de Cossio, Patrick Wade Howard, Sivleng Kouv, Marianne Catanho, Vincent J. Hu, Robert Kyriakakis, Molly E. Allen, Yunhan Ma, Marcelo Aguilar-Rivera, Todd P. Coleman

J Vis Exp. Author manuscript; available in PMC 2022 May 19.

Published in final edited form as: J Vis Exp. 2021 Jan 12; (167): 10.3791/61914. Published online 2021 Jan 12. doi: 10.3791/61914

PMCID:: PMC9119341

Article PDF–2.4M

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CO₂ Laser Fascia to Dura Soldering for Pig Dural Defect Reconstruction

Boaz Forer, Tamar Vasileyev, Ziv Gil, Tamar Brosh, Naam Kariv, Abraham Katzir, Dan M. Fliss

Skull Base. 2007 Jan; 17(1): 17–23. Prepublished online 2007 Jan 8. doi: 10.1055/s-2006-959332

PMCID:: PMC1852579

Article PDF–159K

Select item 881021418.

Development of a course based on BEAM robots to enhance STEM learning in electrical, electronic, and mechanical domains

Carlos Boya-Lara, Doris Saavedra, Aaron Fehrenbach, Angel Marquez-Araque

Int J Educ Technol High Educ. 2022; 19(1): 7. Published online 2022 Feb 3. doi: 10.1186/s41239-021-00311-9

PMCID:: PMC8810214

Article PDF–2.5M

Select item 936971419.

Study of Wettability and Solderability of SiC Ceramics with Ni by Use of Sn-Sb-Ti Solder by Heating with Electron Beam in Vacuum

Roman Kolenak, Igor Kostolny, Jaromir Drapala, Jan Urminsky, Alexej Pluhar, Paulina Babincova, Daniel Drimal

Materials (Basel) 2022 Aug; 15(15): 5301. Published online 2022 Aug 1. doi: 10.3390/ma15155301

PMCID:: PMC9369714

Article PDF–42M

Select item 623892020.

Robot-assisted laser tissue soldering system

Svetlana Basov, Amit Milstein, Erez Sulimani, Max Platkov, Eli Peretz, Marcel Rattunde, Joachim Wagner, Uri Netz, Abraham Katzir, Ilana Nisky

Biomed Opt Express. 2018 Nov 1; 9(11): 5635–5644. Published online 2018 Oct 19. doi: 10.1364/BOE.9.005635

PMCID:: PMC6238920

Article PDF–2.8M

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PMC Images search for soldering test【机】;weld test【机】

Figure 8

(a) The diagram shows the influence of the solder time and the mechanical strength. The lower the soldering time, the higher is the strength during the peeling test.; (b) Microsections of Sn99.7Cu0.3 samples, soldered with different ultrasonic solder times: (1), (3) 0.5 s solder time; (2), (4) 10 s solder time. The red circuits show imperfections in the allow after a longer ultrasonic soldering time.

Automatic Joining of Electrical Components to Smart Textiles by Ultrasonic Soldering

Sensors (Basel). 2021 Jan;21(2):545.
Figure 7

Force-displacement during the peel test. Hot bar soldering (1) shows three different failure mechanisms sequentially. In the case of the IDCs (2), the contacts failed in pairs. The samples with ACAs (3) showed no clear failure mechanism.

Analysis of Hot Bar Soldering, Insulation Displacement Connections (IDC), and Anisotropic Conductive Adhesives (ACA), for the Automated Production of Smart Textiles

Sensors (Basel). 2020 Jan;20(1):5.
FIGURE 4. Mean long-term tensile strength values (in MPa) and standard deviations 7 days postoperatively of specimens tested after soldering at different temperatures. No statistically significant differences were noted (Tukey post hoc test, P > 0.05).

Immediate Tight Sealing of Skin Incisions Using an Innovative Temperature-controlled Laser Soldering Device

Ann Surg. 2007 Feb;245(2):206-213.
Figure 1

Weibull reliability plots from drop test results of assemblies with the Ni(P)|Au-finished soldering pads having the four different P- chemistries.

Combined Thermodynamic-Kinetic Analysis of the Interfacial Reactions between Ni Metallization and Various Lead-Free Solders

Materials (Basel). 2009 Dec;2(4):1796-1834.